Arbitrary Modeling Of Tsvs For 3d Integrated Circuits

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Arbitrary Modeling Of Tsvs For 3d Integrated Circuits

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Arbitrary Modeling Of Tsvs For 3d Integrated Circuits

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Arbitrary Modeling Of Tsvs For 3d Integrated Circuits

This Book Presents A Wide-band And Technology Independent, Spice-compatible Rlc Model For Through-silicon Vias (tsvs) In 3d Integrated Circuits. This Model Accounts For A Variety Of Effects, Including Skin Effect, Depletion Capacitance And Nearby Effects. Readers Will Benefit From In-depth Coverage Of Concepts And Technology Such As 3d Integration, Macro Modeling, Dimensional Analysis And Compact Modeling, As Well As Closed Form Equations For The Through Silicon Via Parasitics.
  • Brand: Springer Nature B.V
  • Category: Computing & Internet
  • Format: Paperback
  • Language: English
  • Publication Date: 2016-08-23
  • Publisher / Label: Springer Nature B.V
  • Author: Khaled Salah
  • Number of Pages: 192
  • Fruugo ID: 557215378-1125484817
  • ISBN: 9783319374970
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