Carbon Nanotubes For Interconnects Process Design And Applications

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Carbon Nanotubes For Interconnects Process Design And Applications

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Carbon Nanotubes For Interconnects Process Design And Applications

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Carbon Nanotubes For Interconnects Process Design And Applications

This Book Provides A Single-source Reference On The Use Of Carbon Nanotubes (cnts) As Interconnect Material For Horizontal, On-chip And 3d Interconnects. The Authors Demonstrate The Uses Of Bundles Of Cnts, As Innovative Conducting Material To Fabricate Interconnect Through-silicon Vias (tsvs), In Order To Improve The Performance, Reliability And Integration Of 3d Integrated Circuits (ics). This Book Will Be First To Provide A Coherent Overview Of Exploiting Carbon Nanotubes For 3d Interconnects Covering Aspects From Processing, Modeling, Simulation, Characterization And Applications.
  • Brand: Springer Nature B.V
  • Category: Computing & Internet
  • Format: Hardcover
  • Language: English
  • Publication Date: 2016-07-18
  • Publisher / Label: Springer Nature B.V
  • Author: Springer Nature B.V
  • Number of Pages: 348
  • Fruugo ID: 557212301-1125481723
  • ISBN: 9783319297446
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