Modeling and Design of Electromagnetic Compatibility for High Speed Printed Circuit Boards and Packaging
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Modeling and Design of Electromagnetic Compatibility for High Speed Printed Circuit Boards and Packaging
- Brand: Taylor & Francis Ltd
Modeling and Design of Electromagnetic Compatibility for High Speed Printed Circuit Boards and Packaging
- Brand: Taylor & Francis Ltd
Save CN¥105.00 (16%)
RRP
14-Day Returns Policy
Save CN¥105.00 (16%)
RRP
14-Day Returns Policy
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Description
Modeling and Design of Electromagnetic Compatibility for High Speed Printed Circuit Boards and Packaging
- Brand: Taylor & Francis Ltd
- Category: Computing & Internet
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Format: Paperback
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Language: English
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Publication Date: 2022-01-24
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Publisher / Label: Taylor & Francis Ltd
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Author: Xing-Chang Wei
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Number of Pages: 322
- Fruugo ID: 344375769-754014932
- ISBN: 9780367573669
Delivery & Returns
Dispatched within 6 days
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STANDARD: CN¥60.49 - Delivery between Wed 04 February 2026–Tue 24 February 2026
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