Three-dimensional Integration And Modeling A Revolution In Rf And Wireless Packa

CN¥339.00
+ CN¥149.99 Shipping

Three-dimensional Integration And Modeling A Revolution In Rf And Wireless Packa

Sold by:
  • product image
Three-dimensional Integration And Modeling A Revolution In Rf And Wireless Packa

CN¥339.00

In stock
+ CN¥149.99 Shipping

14-Day Returns Policy

Payment methods:

Product details

Product details

Three-dimensional Integration And Modeling A Revolution In Rf And Wireless Packa

This Book Presents A Step-by-step Discussion Of The 3d Integration Approach For The Development Of Compact System-on-package (sop) Front-ends.various Examples Of Fully-integrated Passive Building Blocks (cavitymicrostip Filters, Duplexers, Antennas), As Well As A Multilayer Ceramic (ltcc) V-band Transceiver Front-end Midule Demonstrate The Revolutionary Effects Of This Approach In Rfwireless Packaging And Multifunctional Miniaturization. Designs Covered Are Based On Novel Ideas And Are Presented For The First Time For Millimeterwave (60ghz) Ultrabroadband Wireless Modules.
  • Brand: Springer Nature B.V
  • Category: Computing & Internet
  • Format: Paperback
  • Language: English
  • Publication Date: 2007-12-31
  • Publisher / Label: Springer Nature B.V
  • Author: Jong-Hoon Lee
  • Number of Pages: 120
  • Fruugo ID: 557180731-1125449988
  • ISBN: 9783031005756
Delivery

Delivery

Dispatched within 24 hours

  • STANDARD: CN¥149.99 - Delivery between Mon 09 November 2026–Mon 07 December 2026

Shipping from United Kingdom.

Returns

Returns

We do our best to ensure that the products that you order are delivered to you in full and according to your specifications. However, should you receive an incomplete order, or items different from the ones you ordered, or there is some other reason why you are not satisfied with the order, you may return the order, or any products included in the order, and receive a full refund for the items.

View full return policy