Advanced Interconnect And Packaging
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- 品牌: MDPI AG
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Advanced Interconnect And Packaging
Unlike Transistors, The Continuous Downscaling Of Feature Size In Cmos Technology Leads To A Dramatic Rise In Interconnect Resistivity And Concomitant Performance Degradation. At Nanoscale Technology Nodes, Interconnect Delay And Reliability Become The Major Bottlenecks Faced By Modern Integrated Circuits. To Resolve These Interconnect Problems, Various Emerging Technologies, Including Airgap, Nanocarbon, Optical, And Through-silicon Via (tsv), Have Been Proposed And Investigated.
- 品牌: MDPI AG
- 类别: 计算机与互联网
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语言: English
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作者: MDPI AG
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出版日期: 2023-02-20
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页数: 266
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出版社／标签: MDPI AG
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格式: Hardcover
- Fruugo ID: 557203258-1125472684
- ISBN: 9783036567334
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