Arbitrary Modeling Of Tsvs For 3d Integrated Circuits
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Arbitrary Modeling Of Tsvs For 3d Integrated Circuits
This Book Presents A Wide-band And Technology Independent, Spice-compatible Rlc Model For Through-silicon Vias (tsvs) In 3d Integrated Circuits. This Model Accounts For A Variety Of Effects, Including Skin Effect, Depletion Capacitance And Nearby Effects. Readers Will Benefit From In-depth Coverage Of Concepts And Technology Such As 3d Integration, Macro Modeling, Dimensional Analysis And Compact Modeling, As Well As Closed Form Equations For The Through Silicon Via Parasitics.
- 品牌: Springer Nature B.V
- 类别: 计算机与互联网
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语言: English
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作者: Khaled Salah
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出版日期: 2016-08-23
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页数: 192
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出版社／标签: Springer Nature B.V
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格式: Paperback
- Fruugo ID: 557215378-1125484817
- ISBN: 9783319374970
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