Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

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+ CN¥68.99 送货
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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

CN¥1,699.00

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+ CN¥68.99 送货

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由……售出:

CN¥1,699.00

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描述

Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability including probabilistic predictions of the solder lifetime.
  • 品牌: Taylor & Francis Ltd
  • 类别: 科学、 医学与自然
  • 语言: English
  • 作者: Ephraim Suhir (Portland State University Portland USA)
  • 出版日期: 2022-01-24
  • 页数: 382
  • 出版社／标签: Taylor & Francis Ltd
  • 格式: Hardback
  • Fruugo ID: 479477903-997909532
  • ISBN: 9781138624733

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