Carbon Nanotubes For Interconnects Process Design And Applications
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Carbon Nanotubes For Interconnects Process Design And Applications
This Book Provides A Single-source Reference On The Use Of Carbon Nanotubes (cnts) As Interconnect Material For Horizontal, On-chip And 3d Interconnects. The Authors Demonstrate The Uses Of Bundles Of Cnts, As Innovative Conducting Material To Fabricate Interconnect Through-silicon Vias (tsvs), In Order To Improve The Performance, Reliability And Integration Of 3d Integrated Circuits (ics). This Book Will Be First To Provide A Coherent Overview Of Exploiting Carbon Nanotubes For 3d Interconnects Covering Aspects From Processing, Modeling, Simulation, Characterization And Applications.
- 品牌: Springer Nature B.V
- 类别: 计算机与互联网
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语言: English
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作者: Springer Nature B.V
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出版日期: 2016-07-18
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页数: 348
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出版社／标签: Springer Nature B.V
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格式: Hardcover
- Fruugo ID: 557212301-1125481723
- ISBN: 9783319297446
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