Design For High Performance Low Power And Reliable 3d Integrated Circuits
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Design For High Performance Low Power And Reliable 3d Integrated Circuits
This Book Provides Readers With A Variety Of Algorithms And Software Tools, Dedicated To The Physical Design Of Through-silicon-via (tsv) Based, Three-dimensional Integrated Circuits. It Describes Numerous Manufacturing-ready Gdsii-level Layouts Of Tsv-based 3d Ics Developed With The Tools Covered In The Book. This Book Will Also Feature Sign-off Level Analysis Of Timing, Power, Signal Integrity, And Thermal Analysis For 3d Ic Designs.
- 品牌: Springer Nature B.V
- 类别: 计算机与互联网
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语言: English
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作者: Sung Kyu Lim
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出版日期: 2014-12-16
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页数: 590
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出版社／标签: Springer Nature B.V
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格式: Paperback
- Fruugo ID: 557057706-1125326203
- ISBN: 9781489986962
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