Modeling and Design of Electromagnetic Compatibility for High Speed Printed Circuit Boards and Packaging

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Modeling and Design of Electromagnetic Compatibility for High Speed Printed Circuit Boards and Packaging

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Modeling and Design of Electromagnetic Compatibility for High Speed Printed Circuit Boards and Packaging

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Modeling and Design of Electromagnetic Compatibility for High Speed Printed Circuit Boards and Packaging

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI) power
  • Fruugo ID: 344375769-754014932
  • ISBN: 9780367573669

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