Pick-up Process Analysis Of A Die Bonder
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Pick-up Process Analysis Of A Die Bonder
The Gallium Arsenide (gaas) Circuits In Advanced Communication Application Have Been Considered To Profoundly Supersede The Conventional Silicon-based Counterpart. Great Improvements In The Packaging Of Gaas Devices Are Needed To Overcome The Imminent Handicap Of Its Fragile Characteristic; Thin Die Represents The Mainstream For Ic Packages To Achieve The Goal Of Manufacturing Compact And Light Products With Higher Functionality. These Trends Tend To Challenge The Existing Infrastructure, Henceforth; The Creative Design In Connection With A Unique Die Bonder In Fabrication Has Been Presented In This Book.
- 品牌: KS OmniScriptum Publishing
- 类别: 计算机与互联网
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语言: English
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作者: Yeong-Jyh Lin
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出版日期: 2008-04-25
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页数: 136
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出版社／标签: KS OmniScriptum Publishing
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格式: Paperback
- Fruugo ID: 557231056-1125500451
- ISBN: 9783639000344
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