Simulation And Reliability Assessment Of Advanced Packaging
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- 品牌: MDPI AG
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Simulation And Reliability Assessment Of Advanced Packaging
Topics Covered In This Reprint Include Material Characterization, Theoretical And Empirical Methods, Modeling, Simulation Technology, Design And Validation, And Ai-assisted Design-on-simulation Technology For Electronic Packaging. Package Design Engineers, Researchers, And Graduate Students Involved In Thermalmechanical Modeling, Package Design, Material Selection, Qualification, And Reliability Assessment Of Advanced Packaging Will Benefit From This Reprint.
- 品牌: MDPI AG
- 类别: 计算机与互联网
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语言: English
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作者: MDPI AG
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出版日期: 2024-04-30
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页数: 296
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出版社／标签: MDPI AG
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格式: Hardcover
- Fruugo ID: 557268873-1125538773
- ISBN: 9783725809721
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