Solder Paste In Electronics Packaging Technology And Applications In Surface Mou
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Solder Paste In Electronics Packaging Technology And Applications In Surface Mou
One Of The Strongest Trends In The Design And Manufacture Of Modern Electronics Packages And Assemblies Is The Utilization Of Surface Mount Technology As A Replacement For Through-hole Tech Nology. The Mounting Of Electronic Devices And Components Onto The Surface Of A Printed Wiring Board Or Other Substrate Offers Many Advantages Over Inserting The Leads Of Devices Or Components Into Holes. From The Engineering Viewpoint, Much Higher Lead Counts With Shorter Wire And Interconnection Lengths Can Be Accommo Dated.
- 品牌: Springer Nature B.V
- 类别: 计算机与互联网
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语言: English
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作者: Jennie S. Hwang
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出版日期: 1992-09-24
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页数: 484
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出版社／标签: Springer Nature B.V
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格式: Paperback
- Fruugo ID: 550928835-1115607311
- ISBN: 9780442013530
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