Three-dimensional Integration And Modeling A Revolution In Rf And Wireless Packa
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Three-dimensional Integration And Modeling A Revolution In Rf And Wireless Packa
This Book Presents A Step-by-step Discussion Of The 3d Integration Approach For The Development Of Compact System-on-package (sop) Front-ends.various Examples Of Fully-integrated Passive Building Blocks (cavitymicrostip Filters, Duplexers, Antennas), As Well As A Multilayer Ceramic (ltcc) V-band Transceiver Front-end Midule Demonstrate The Revolutionary Effects Of This Approach In Rfwireless Packaging And Multifunctional Miniaturization. Designs Covered Are Based On Novel Ideas And Are Presented For The First Time For Millimeterwave (60ghz) Ultrabroadband Wireless Modules.
- 品牌: Springer Nature B.V
- 类别: 计算机与互联网
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语言: English
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作者: Jong-Hoon Lee
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出版日期: 2007-12-31
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页数: 120
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出版社／标签: Springer Nature B.V
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格式: Paperback
- Fruugo ID: 557180731-1125449988
- ISBN: 9783031005756
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